SEMICONDUCTOR MOLD & DIE LIMITED
半導體模具製作有限公司 (CR No. 0255807)

SEMICONDUCTOR MOLD & DIE LIMITED was incorporated on 1989-06-21 as a Private company limited by shares registered in Hong Kong. It's company registration number is: 0255807. The company is Dissolved now.

Company Name:
SEMICONDUCTOR MOLD & DIE LIMITED
Company Name (Traditional Chinese):
半導體模具製作有限公司
CR No.
0255807
Date of Incorporation:
1989-06-21
Company Type:
Private company limited by shares
Company Status:
Dissolved
Remarks:
Dissolved by Deregistration
Date of Dissolution:
2004-07-30
Register of Charges:
Unavailable
Name History:
1996-05-02
SEMICONDUCTOR MOLD & DIE LIMITED
1993-02-18
SEMICONDUCTOR MOLD & DIES LIMITED
1992-11-17
SEMI-CONDUCTOR MOLD & DIES LIMITED
1989-06-21
KUK JE MOLD & DIES (INTERNATIONAL) LIMITED
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